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The difference between chemical polishing and chemical polishing for plane lapping machine.
Apr 12, 2018

1. Chemical grinding and polishing: impregnating metal in a special chemical solution of various components and dissolving the metal surface naturally by chemical energy to obtain a smooth and bright surface. Chemical grinding is only the impregnation operation, the operation is simple, and the electrolytic grinding and polishing needs large capacity DC, the current to the pole, the accurate current and voltage control, the operation process is complex, the quality control is difficult, some special work pieces can not be processed yet. People have been looking forward to the appearance of better and better grinding methods. Although some pure chemical grinding and polishing techniques have appeared during this period, the products which are compared with the methods of electrolytic grinding have not appeared to meet the important technical indexes such as the gloss environmental protection and the grinding effect. The process of grinding the workpiece surface into smooth and bright surface by chemical reaction and dissolution.

Two. Electrolytic chemical grinding and polishing: impregnating metal in a special chemical solution of various components, dissolving the metal surface by the current energy anode to obtain a smooth and bright surface. The surface of the grinding workpiece is turned into smooth bright surface by electrochemical reaction anodic dissolution. The surface of the grinding workpiece is turned smooth and bright through cutting, plastic deformation and wear. The surface of the grinding surface is chemically reacted to produce a layer of protective film, and the corrosion resistance and wear resistance are improved and the luster is long lasting. With the influence of plastic deformation on the left, the surface of the hardened layer and lattice structure change, the corrosion resistance and wear resistance are weakened, it is easy to oxidize the hair again, and the luster is not durable; the surface of the grinding surface is smooth and uniform, and the flow resistance is small. The above is the difference between the plane lapping machine and the two grinding machines.